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24.07.14 /  Kategorie: Aktive Bauelemente

TS4148 Switching Diode in most versatile Chip Package



With the TS4148 switching diode family TSC offers an SMD ceramic package (0603, 0805, 1206) as pad layout compatible replacement for (Mini-/ Micro-) MELF.

The ceramic package is distinguished through low SMD process failure rate, by offering better solderability compared to MELF package and minimizing tomb-stone effect and high throw-off rate. It is therefore a cost efficient solution to replace existing MELF designs for the highest SMD process reliability.


  • Designed for mounting on small surface
  • Extremely thin/ leadless package
  • High mounting capability, strong surage with stand, high reliability
  • Pb free version and RoHS compliant
  • Halogen free

Mechanical data:

  • Case: 0603, 0805, 1206; standard package, molded plastic
  • Terminal: Gold plated, solderable per MIL-STD-750, method 2026 guaranteed
  • High temperature soldering guaranteed: 260C/10s
  • Polarity: Indicated by cathode band
  • Weight: 0.004g, 0.006g, 0.010g